Impact of thermal treatment temperature on copper oxide formation from copper films

Abstract

This study investigates the effects of thermal treatment (TT) in air [1] on the morphology and chemical composition of copper oxide (CuO) films using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) [2]. The results demonstrate that the temperature of TT significantly influences the formation of CuO structures. Nanowires were predominantly obtained at temperatures up to 500 °C. However, as the temperature increased, mixed structures of nanowires and CuO layers were formed. A drastic reduction in the number of CuO nanowires was observed at 800 °C. Chemical composition analysis confirmed the formation of CuO. Furthermore, the influence of a gold layer deposited on the copper film prior to thermal treatment was also investigated. Additionally, it was demonstrated that the obtained CuO films can be detached from the copper substrate through rapid cooling. In contrast, at slow cooling maintaining the sample in the oven until reaching 150°C before removal, results in the formation of a CuO layer on the copper substrate.