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Hardness of Cu/LiF composite structure under dynamical indentation

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dc.contributor.author PYRTSAC, C.
dc.date.accessioned 2021-11-05T07:46:23Z
dc.date.available 2021-11-05T07:46:23Z
dc.date.issued 2012
dc.identifier.citation C. PYRTSAC. Hardness of Cu/LiF composite structure under dynamical indentation. In: Materials Science and Condensed Matter Physics: proc. : ed. 6, 11-14 septembrie 2012, Chişinău, Moldova, 2012, p. 231. ISBN 978-9975-66-290-1. en_US
dc.identifier.isbn 978-9975-66-290-1
dc.identifier.uri http://repository.utm.md/handle/5014/17891
dc.description.abstract A permanent growth of the integration level and packaging density of chips on the crystals requires the sufficient increase of reliability and enhancement of the material servicing characteristics. At present, as a rule, aluminium and Al-Cu alloys are used as basic material for the interconnections. As a potential substitute for Al, it can be considered copper, which possesses higher properties: thermal capacity, thermal conductivity, electroconductivity and considerable resistance to the electromigration. It is known, servicing characteristics of thin metallic films are generally determined by electrical properties. At the same time, mechanical properties determine the service life period of product, therefore it is necessary to make the durable and reliable goods. en_US
dc.language.iso en en_US
dc.publisher Institutul de Fizică Aplicată al AŞM en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject crystals en_US
dc.subject thin films en_US
dc.subject metallic films en_US
dc.subject films en_US
dc.title Hardness of Cu/LiF composite structure under dynamical indentation en_US
dc.type Article en_US


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