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Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation

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dc.contributor.author GRABCO, D.
dc.contributor.author PYRTSAC, C.
dc.contributor.author SHIKIMAKA, O.
dc.date.accessioned 2021-11-11T13:32:38Z
dc.date.available 2021-11-11T13:32:38Z
dc.date.issued 2021
dc.identifier.citation GRABCO, D., PYRTSAC, C., SHIKIMAKA, O. Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation. In: ICNMBE-2021: the 5th International Conference on Nanotechnologies and Biomedical Engineering, November 3-5, 2021: Program and abstract book. Chişinău, 2021, p. 64. ISBN 978-9975-72-592-7. en_US
dc.identifier.isbn 978-9975-72-592-7
dc.identifier.uri http://repository.utm.md/handle/5014/17974
dc.description Only Abstract. en_US
dc.description.abstract In this work, we studied the relaxation parameters, he-p and hres, of three composite structures Cu/LiF, Cu/MgO, and Cu/Si, which have different types of a chemical bond between the substrates (ionic (LiF), ionic-covalent (MgO), and covalent (Si)) and differ in hardness (HCu = 0.6 GPa, HLiF, HMgO and HSi are 1.2, 7.5 and 8.2 GPa, respectively). For each type of substrates, coated systems (CSs) were fabricated with a following Cu film thickness: t1 = 85; t2 = 470 and t3 = 1000 nm. The behavior of relaxation parameters was examined over a wide range of loads, P=2-900 mN, during nanoindentation. The elastic- plastic parameters were shown to depend on the CS type, as well as on the film thickness and the magnitude of the applied load. en_US
dc.language.iso en en_US
dc.publisher Universitatea Tehnică a Moldovei en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject relaxation parameters en_US
dc.subject chemical bond en_US
dc.subject nanoindentation en_US
dc.title Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation en_US
dc.type Article en_US


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