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Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation
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| dc.contributor.author | GRABCO, D. | |
| dc.contributor.author | PYRTSAC, C. | |
| dc.contributor.author | SHIKIMAKA, O. | |
| dc.date.accessioned | 2021-11-11T13:32:38Z | |
| dc.date.available | 2021-11-11T13:32:38Z | |
| dc.date.issued | 2021 | |
| dc.identifier.citation | GRABCO, D., PYRTSAC, C., SHIKIMAKA, O. Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation. In: ICNMBE-2021: the 5th International Conference on Nanotechnologies and Biomedical Engineering, November 3-5, 2021: Program and abstract book. Chişinău, 2021, p. 64. ISBN 978-9975-72-592-7. | en_US |
| dc.identifier.isbn | 978-9975-72-592-7 | |
| dc.identifier.uri | http://repository.utm.md/handle/5014/17974 | |
| dc.description | Only Abstract. | en_US |
| dc.description.abstract | In this work, we studied the relaxation parameters, he-p and hres, of three composite structures Cu/LiF, Cu/MgO, and Cu/Si, which have different types of a chemical bond between the substrates (ionic (LiF), ionic-covalent (MgO), and covalent (Si)) and differ in hardness (HCu = 0.6 GPa, HLiF, HMgO and HSi are 1.2, 7.5 and 8.2 GPa, respectively). For each type of substrates, coated systems (CSs) were fabricated with a following Cu film thickness: t1 = 85; t2 = 470 and t3 = 1000 nm. The behavior of relaxation parameters was examined over a wide range of loads, P=2-900 mN, during nanoindentation. The elastic- plastic parameters were shown to depend on the CS type, as well as on the film thickness and the magnitude of the applied load. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Universitatea Tehnică a Moldovei | en_US |
| dc.rights | Attribution-NonCommercial-NoDerivs 3.0 United States | * |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/us/ | * |
| dc.subject | relaxation parameters | en_US |
| dc.subject | chemical bond | en_US |
| dc.subject | nanoindentation | en_US |
| dc.title | Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation | en_US |
| dc.type | Article | en_US |
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