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Initiated chemical vapor deposition of tailored polymer thin films for electronic applications

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dc.contributor.author SCHRÖDER, Stefan
dc.date.accessioned 2022-12-29T10:55:56Z
dc.date.available 2022-12-29T10:55:56Z
dc.date.issued 2022
dc.identifier.citation SCHRÖDER, Stefan. Initiated chemical vapor deposition of tailored polymer thin films for electronic applications. In: Electronics, Communications and Computing (IC ECCO-2022): 12th intern. conf., 20-21 Oct. 2022, Chişinău, Republica Moldova: conf. proc., Chişinău, 2022, pp. 19. en_US
dc.identifier.uri http://repository.utm.md/handle/5014/21887
dc.description Only Abstract
dc.description.abstract Device miniaturization and the consequent need for new thin film materials on the nanoscale is a current trend in electronic devices in research as well as industrial production lines. The solvent-free, single-step initiated chemical vapor deposition (iCVD) process combines the advantages of CVD with organic chemistry and enables the fabrication of tailored polymer thin films on the nanoscale on complex geometries and large-area substrates. The talk presents results from fundamental studies on the process to advanced electronic devices. These range from sensors and generators to soft robotics. With the help of additional computational ab-initio approaches, the properties of the thin films can be tailored on the molecular scale. It turns out that the process provides new pathways for electronic applications requiring precise film thickness control and high film quality. en_US
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject chemical vapor depositions en_US
dc.subject polymer thin films en_US
dc.subject electronic devices en_US
dc.title Initiated chemical vapor deposition of tailored polymer thin films for electronic applications en_US
dc.type Article en_US


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  • 2022
    Proceedings of the 12th IC|ECCO; October 20-21, 2022

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Attribution-NonCommercial-NoDerivs 3.0 United States Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 United States

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