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Using of the MEAM model for adjusting the technological parameters of magnetron deposition of Nb/Co nanolayers

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dc.contributor.author BOIAN, Vladimir
dc.contributor.author BOIAN, Eugen
dc.date.accessioned 2024-04-25T08:54:54Z
dc.date.available 2024-04-25T08:54:54Z
dc.date.issued 2024
dc.identifier.citation BOIAN, Vladimir, BOIAN, Eugen. Using of the MEAM model for adjusting the technological parameters of magnetron deposition of Nb/Co nanolayers. In: Quo Vadis – Ethics of the Scientific Research: conf. NANO-2024, event devoted to the 60th anniversary of the Technical University of Moldova, 15-18 April 2024, Chişinău, Republica Moldova: Program and proceedings of the conference, Chişinău 2024, pp. 67. ISBN 978-9975-64-422-8. en_US
dc.identifier.isbn 978-9975-64-422-8
dc.identifier.uri http://repository.utm.md/handle/5014/26910
dc.description.abstract Superconductivity and ferromagnetism being two antagonistic orders, we can meet them only in artificial formations, usually in the form of nanolayers deposited by certain technological methods. A common and highly effective method is the deposition of nanolayers by the magnetron method. Deposition by the magnetron sputtering method proposes nanofilms of well- controlled thicknesses, deposition in a single vacuum cycle and reproduction of layered structures with high precision. en_US
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.relation.ispartofseries NANO-2024 "Quo Vadis – Ethics of the Scientific Research", event devoted to the 60th anniversary of the Technical University of Moldova;15-18 April 2024, Chişinău, Republica Moldova
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject modified embedded atom method (MEAM) en_US
dc.subject magnetron method en_US
dc.subject nanolayers en_US
dc.subject nanofilms en_US
dc.title Using of the MEAM model for adjusting the technological parameters of magnetron deposition of Nb/Co nanolayers en_US
dc.type Article en_US


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