DSpace Repository

Microsystems and reliability

Show simple item record

dc.contributor.author BĂJENESCU, Titu-Marius I.
dc.date.accessioned 2019-02-11T10:52:58Z
dc.date.available 2019-02-11T10:52:58Z
dc.date.issued 2017
dc.identifier.citation BĂJENESCU, Titu-Marius I. Microsystems and reliability. In: Meridian Ingineresc. 2017, nr. 4, pp. 24-31. ISSN 1683-853X. en_US
dc.identifier.issn 1683-853X
dc.identifier.uri http://repository.utm.md/handle/5014/272
dc.description.abstract After a brief introduction, the reliability problems specific of microsensors, microactuators, ink jet print heads, actuators, electrostatic MEMS, microfabrication processes, and the differences between the manufacture of integrated circuits and microfabrication, the 3D manufacturing characteristics, the factors that affect their reliability and the failure mechanisms are reviewed. en_US
dc.description.abstract După o scurtă introducere, sunt trecute în revistă probleme fiabiliste specifice microsenzorilor, elementelor de microacţionare, capetelor de imprimare cu jet de cerneală, mecanismelor de acţionare, sistemelor MEMS electrostatice, proceselor de microfabricare, se menţionează diferenţele dintre fabricarea circuitelor integrate şi microfabricare, caracteristicile fabricării 3D, factorii care afectează fiabilitatea acestora şi mecanismele de defectare. ro
dc.description.abstract Après une brève introduction, les problèmes de fiabilité spécifiques aux micro-capteurs, microactionneurs, têtes d'impression à jet d'encre, actionneurs, MEMS électrostatiques, procédés de microfabrication, et les différences entre la fabrication de circuits intégrés et la microfabrication, les caractéristiques de la fabrication 3D, les facteurs qui affectent leur fiabilité et les mécanismes de défaillance sont passés en revue. fr
dc.description.abstract После краткого введения были рассмотрены проблемы надежности, характерные для микродатчиков, микросхем, струйных печатающих головок, приводов, электростатических MEMS-систем, процессов микрообработки. Упоминаются различия между изготовлением интегральных схем и микрообработкой, производственные 3D характеристики, факторы, которые влияют на их надежность и механизмы сбоев. ru
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject microsystem reliability en_US
dc.subject microsystem failure mechanisms en_US
dc.subject reliability en_US
dc.subject fiabilitatea microsistemelor en_US
dc.subject mecanisme de defectare a microsistemelor en_US
dc.subject fiabilitate en_US
dc.title Microsystems and reliability en_US
dc.title.alternative Microsisteme şi fiabilitate en_US
dc.title.alternative Microsystèmes et fiabilité en_US
dc.title.alternative Микросистемы и надежность en_US
dc.type Article en_US


Files in this item

The following license files are associated with this item:

This item appears in the following Collection(s)

Show simple item record

Attribution-NonCommercial-NoDerivs 3.0 United States Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 United States

Search DSpace


Advanced Search

Browse

My Account