Pulsed Electroplating of Metal Nanoparticles form DODUCO Electrolytes

Abstract

The mechanisms of Au deposition on InP porous substrates during a pulsed electroplating process are investigated by means of Topography imaging and Current Mapping measurements. The obtained results confirm the formation of Schottky barriers at the interface of the semiconductor substrate with Au nanoparticles with diameters around 20 nm, and corroborate the hypothesis that the mechanism of Au nanoparticles self-assembling into monolayers is governed by the formation of such Schottky barriers. The analysis of current-voltage curves suggest also the deposition of a dielectric film over the larger Au particles produced with long duration pulsed electroplating from DODUCO solutions.