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Fiabilitatea încapsulărilor microelectronice

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dc.contributor.author BĂJENESCU, Titu-Marius I.
dc.date.accessioned 2019-02-13T10:17:14Z
dc.date.available 2019-02-13T10:17:14Z
dc.date.issued 2017
dc.identifier.citation BĂJENESCU, Titu-Marius I. Fiabilitatea încapsulărilor microelectronice. In: Meridian Ingineresc. 2017, nr. 1(64), pp. 45-50. ISSN 1683-853X. en_US
dc.identifier.issn 1683-853X
dc.identifier.uri http://repository.utm.md/handle/5014/346
dc.description.abstract Defectările capsulelor au evoluat în timp; încapsulările actuale fac apel la o mulțime de materiale diferite, iar unele din cele mai mari probleme au avut loc datorită coeficienților de expansiune în interiorul materialelor. Pe măsură ce crește utilizarea tehnologiei de încapsulare flip chip, sunt necesare cunoștințe extinse în materie de încapsulare. en_US
dc.description.abstract Packaging defects have evolved over time; today’s packages involve a variety of different materials and some of the greatest problems have occurred due to mismatches in the expansion coefficients within the materials. With the increase in usage of the Flip Chip packaging technology, an extensive knowledge of packaging is mandatory. en
dc.description.abstract Les défaillances des capsules ont évolué dans le temps; les encapsulations actuelles font appel à de nombreux matériaux différents et certains des plus grands problèmes qui ont eu lieu sont dus aux coefficients d’expansion à l’intérieur des matériaux. Au fur et à mesure que l’utilisation de la technologie d’encapsulation flip chip augmente, sont nécessaire des connaissances étendues concernant l’encapsulation. fr
dc.description.abstract Дефекты упаковки со временем эволюционировали. В сегодняшних пакетах задействовано множество различных материалов, и некоторые из самых больших проблем возникли из-за несоответствия коэффициентов расширения в материалах. С ростом использования технологии упаковки Flip Chip необходимы обширные знания в области упаковки. ru
dc.language.iso ro en_US
dc.publisher Tehnica UTM en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject reliability of microelectronic packaging en_US
dc.subject expansion coefficients en_US
dc.subject coeficienți de expansiune en_US
dc.subject fiabilitatea încapsulărilor microelectronice en_US
dc.title Fiabilitatea încapsulărilor microelectronice en_US
dc.title.alternative Reliability of microelectronic packaging en_US
dc.title.alternative La fiabilité des encapsulations microélectroniques en_US
dc.title.alternative Надежность микроэлектронной упаковки en_US
dc.type Article en_US


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