Materials for Integrated of THz sensors in EWOD chips

SIRBU, Lilian; MULLER, Raluca; DANILA, Mihai; SCHIOPU, Vasilica; MATEI, Alina; COMANESCU, Florin; STEFAN, Angela; BARACU, Angela; DASCALU, Traian

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Materials for Integrated of THz sensors in EWOD chips

SIRBU, Lilian; MULLER, Raluca; DANILA, Mihai; SCHIOPU, Vasilica; MATEI, Alina; COMANESCU, Florin; STEFAN, Angela; BARACU, Angela; DASCALU, Traian

URI: http://repository.utm.md/handle/5014/4951

Date: 2014

Abstract:

We developed a technology for deposition of metal contacts/wires upon nanoporous InP thin film structures and RF sputtered InP films. Indium phosphide (InP) films were deposited onto glass substrate using RF magnetron sputtering by varying the substrate temperature (50–100oC), under constant argon pressure (6.3•10-3 Bar) and RF power (40-100 W).

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