Investigation of Mesoporous Structures for Thermoelectric Applications

COJOCARU, A.; CARSTENSEN, J.; BOOR, J.; SCHMIDT, V.; FÖLL, H.

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dc.contributor.author	COJOCARU, A.
dc.contributor.author	CARSTENSEN, J.
dc.contributor.author	BOOR, J.
dc.contributor.author	SCHMIDT, V.
dc.contributor.author	FÖLL, H.
dc.date.accessioned	2019-10-22T10:00:52Z
dc.date.available	2019-10-22T10:00:52Z
dc.date.issued	2011
dc.identifier.citation	COJOCARU, A., CARSTENSEN, J., BOOR, J. et al. Investigation of Mesoporous Structures for Thermoelectric Applications. In: ICNBME-2011. International conference on Nanotechnologies and Biomedical Engineering. German-moldovan workshop on Novel Nanomaterials for Electronic, Photonic and Biomedical Applications: proc. of the intern. conf., July 7-8, 2011. Chişinău, 2011, pp. 21-23. ISBN 978-9975-66-239-0.	en_US
dc.identifier.isbn	978-9975-66-239-0
dc.identifier.uri	http://repository.utm.md/handle/5014/4995
dc.description.abstract	Mesoporous silicon is an attractive material for thermoelectric application. For pore wall thicknesses around <100nm, phonons can not penetrate the porous layer while electrons still can, due to there smaller mean free path length. The resulting good electrical and bad thermal conductivity is a premise for efficient thermoelectric devices. This paper presents results regarding homogeneity, high porosity, and optimal pore wall thicknesses for porous silicon based thermoelectric devices.	en_US
dc.language.iso	en	en_US
dc.publisher	Technical University of Moldova	en_US
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 United States	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.subject	electrochemical etching	en_US
dc.subject	mesoporous silicon	en_US
dc.subject	thermoelectric applications	en_US
dc.title	Investigation of Mesoporous Structures for Thermoelectric Applications	en_US
dc.type	Article	en_US