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Two Simple Examples for the Micro-nano Integration of Nanowires as Electronic Device Elements

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dc.contributor.author ADELUNG, Rainer
dc.date.accessioned 2019-10-22T10:21:09Z
dc.date.available 2019-10-22T10:21:09Z
dc.date.issued 2011
dc.identifier.citation ADELUNG, Rainer. Two Simple Examples for the Micro-nano Integration of Nanowires as Electronic Device Elements. In: ICNBME-2011. International conference on Nanotechnologies and Biomedical Engineering. German-moldovan workshop on Novel Nanomaterials for Electronic, Photonic and Biomedical Applications: proc. of the intern. conf., July 7-8, 2011. Chişinău, 2011, pp. 25-27. ISBN 978-9975-66-239-0. en_US
dc.identifier.isbn 978-9975-66-239-0
dc.identifier.uri http://repository.utm.md/handle/5014/5001
dc.description.abstract As a part of the conference talk about the mass fabrication and applications of nanostructures, the aim of this paper is to review and compare two approaches for the simple fabrication and integration and of nanostructures into Si-based microchips. The purpose of the integration is the utilization of the different and advanced electronic properties of nanowires. The first method is based on a fracture approach, that integrates nanowires bound to a Si substrate between micro electrodes. These are arrange in a horizontal manner, the second approach allows to integrate free standing nanowires and even 3 dimensional nanowire networks in the chip. As an example for the electronic properties of the nano-micro integrated structures the UV light sensitivity is sown here. en_US
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject nanowires en_US
dc.subject nanostructures en_US
dc.subject nanochips en_US
dc.title Two Simple Examples for the Micro-nano Integration of Nanowires as Electronic Device Elements en_US
dc.type Article en_US


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