Abstract:
In today’s world we are facing with many different types of emergencies which are caused increasing temperature. Response to such emergencies is critical in order to protect resources including uman life and also we can save property from damage. In order to prevent disasters caused by structural failure due increasing temperatures, temperature sensors are needed.
In this paper is shown design of temperature sensor, fabricated in thick film technology, and realized wireless communication between sensor node (sensor board) and PC node for collecting data (data board). Temperature sensor (thermistor) is made in thick film technology using NTC paste and PdAg electrodes applied on alumina substrate. A wireless communication is realized using developed peripheral node, router node and receiver nodes based on 8-bit microcontrollers and RF Transmitter/Receiver modules.
An intention is that temperature monitoring of depth sensors will be applied to measure temperature in some of the applications which requires for this kind of monitoring, as asphalt of burdened high way, or some walls of hazardous rooms.