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3D micropackaging of integrated circuits

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dc.contributor.author BĂJENESCU, Titu-Marius I.
dc.date.accessioned 2020-06-10T09:30:53Z
dc.date.available 2020-06-10T09:30:53Z
dc.date.issued 2020
dc.identifier.citation BĂJENESCU, Titu-Marius I. 3D micropackaging of integrated circuits. In: Journal of Engineering Science. 2020, Vol. 27(1), pp. 28-35. ISSN 2587-3474. eISSN 2587-3482. en_US
dc.identifier.issn 2587-3474
dc.identifier.issn 2587-3482
dc.identifier.uri https://doi.org/10.5281/zenodo.3713360
dc.identifier.uri http://repository.utm.md/handle/5014/8869
dc.description.abstract A major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also, reliability concerns will be extremely important: electromigration and stress-migration. This paper presents some actual problems and reliability challenges in 3D IC packaging technology. It shows how different architectures have evolved to meet the specific needs of different markets: Multi Chip Module (MCP); Multipackage module (MPM); Embedded SIP modules; SIP package-on-package (PoP) modules; EMIB (Embedded Multi-die Interconnect Bridge); Silicon-based SIP-Module; 3D-TSV stacked module; SIP variants with combinations of wideband and flip-chip interconnects. Causes of blockages and failure mechanisms, as well as problems with predictive reliability, which will need to be developed in the coming years, are analysed. en_US
dc.description.abstract O modificare majoră de paradigmă, de la 2D IC la 3D IC, se produce în industria microelectronică. Încălzirea Joule este gravă în 3D IC, iar interconectarea verticală este elementul critic care trebuie dezvoltat. De asemenea, preocupările privind fiabilitatea vor fi extrem de importante: electromigrare și migrare la stres. Această lucrare prezintă unele probleme reale și provocări de fiabilitate în tehnologia de ambalare 3D IC. Este aratat cum au evoluat diferite arhitecturi pentru a satisface nevoile specifice pentru diferite pieţe. Este prezentat modul în care diferite arhitecturi au evoluat pentru a răspunde nevoilor specifice ale pieţei: Multi Chip Module (MCP); Modul multipackage (MPM); Module SIP încorporate; Module SIP package-on-package (PoP); EMIB (podul de interconectare multi-die încorporat); Modul SIP bazat pe silicon; Modul stivuit 3D-TSV; Variante SIP cu combinaţii de interconectări cu bandă largă și flip-chip. Sunt analizate cauzele blocajelor si mecanismele de eșec, precum si probleme legate de fiabilitatea predictivă, care va trebui să fie dezvoltată în anii următori. ro
dc.language.iso en en_US
dc.publisher Tehnica UTM en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject prototypage virtuel en_US
dc.subject Moore's Law en_US
dc.subject reliability en_US
dc.subject microelectronic industry en_US
dc.subject prototipaj virtual en_US
dc.subject legea Moore en_US
dc.subject fiabilitate en_US
dc.subject circuite integrate en_US
dc.subject industria microelectronică en_US
dc.title 3D micropackaging of integrated circuits en_US
dc.type Article en_US


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