Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat

GANGAN, Silvia; ROTARU, Mihail; DIMITRACHE, Pavel; POPESCU, Nicolae

Home
→
Facultatea Electronică şi Telecomunicaţii
→
Conferinţa Internaţională "Telecomunicaţii, Electronică şi Informatică" - ICTEI
→
2012
→
View Item

dc.contributor.author	GANGAN, Silvia
dc.contributor.author	ROTARU, Mihail
dc.contributor.author	DIMITRACHE, Pavel
dc.contributor.author	POPESCU, Nicolae
dc.date.accessioned	2019-12-06T08:39:30Z
dc.date.available	2019-12-06T08:39:30Z
dc.date.issued	2012
dc.identifier.citation	GANGAN, Silvia, ROTARU, Mihail, DIMITRACHE, Pavel et al. Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat. In: Telecommunications, Electronics and Informatics- ICTEI 2012: proc. of the 5th intern. conf., Technical University of Moldova, May 11-13, 2012. Chișinău, 2012, Vol. 1, pp. 271-274. ISBN 978-9975-45-082-9.	en_US
dc.identifier.isbn	978-9975-45-082-9
dc.identifier.uri	http://repository.utm.md/handle/5014/7322
dc.description.abstract	This article presents some peculiarities of assembly of BGA – components on the surface of multilayer printed circuit. Difficulties in the choice of ball terminals and controlling the soldering quality are described. An algorithm for the inspection of the quality by gradually measuring of electrical parameters is proposed.	en_US
dc.language.iso	ro	en_US
dc.publisher	Technical University of Moldova	en_US
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 United States	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.subject	ball grid array components	en_US
dc.subject	BGA	en_US
dc.subject	carcase	en_US
dc.subject	circuite imprimate	en_US
dc.subject	roentgenograme	en_US
dc.subject	multistraturi	en_US
dc.title	Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat	en_US
dc.type	Article	en_US